1. There are four types of plate chucks, which can vacuum absorb 5"×5" or 4"×4" or 3"×3" square masks. The thickness of the registration plate

There are no special requirements for the thickness (anything from 1 to 4 mm is acceptable).

2. There are three corresponding "wafer receiving stages" for vacuum adsorption of substrates, which are suitable for φ2 and φ respectively.

3. φ4. For non-standard pieces or fragments, as long as the corresponding small holes are blocked, they can also be vacuum adsorbed.

Exposure area: 100mm* 100mm

Exposure unevenness ≤3%

Exposure intensity ≥40mW/cm² adjustable

UV beam angle ≤3° UV center wavelength 365nm, 404nm, 435nm optional

UV light source life: ≥20,000 hours

4. The electronically controlled shutter accurately controls the exposure time, and the exposure power is accurately and continuously adjustable from 0% to 100%.

5. This machine is a contact exposure machine, but it can achieve:

a. Hard contact exposure: Use pipeline vacuum to obtain high vacuum contact. Vacuum ≤-0.05MPa.

b. Soft contact exposure: The contact pressure can reduce the vacuum to between -0.02MPa ~ -0.05MPa.

c. Micro-force contact exposure: smaller than soft contact. Vacuum ≥-0.02MPa.

6. Resolution estimation: If the accuracy of the user's "version" and "film" meets national regulations, the environment,

Temperature, humidity, and dust are strictly controlled, imported positive photoresist is used, and the uniform thickness is strictly controlled. If the front and back processes are advanced, the minimum resolution of hard contact exposure can reach 0. 5μm-0.8μm.

7. Alignment accuracy: ±0. 5μm

8. Overlay accuracy: ±0. 5μm

9. Using a 22" LCD monitor, its digital magnification is 19÷1/3 = 57 times;

10. The magnification of the observation system is: 0.7×57≈40 times (minimum multiple), 4.5×57≈

256 times (maximum multiple) or (91 times to 570 times)

 

Ultraviolet lithography machine is a key equipment specially used in high-tech fields such as microelectronics, semiconductors, and flat-panel displays. It uses an ultraviolet light source to photoetch photoresist onto silicon wafers, photomasks, or other substrates to form fine patterns and structures. UV lithography machines have the advantages of high resolution, high accuracy, and fast speed, and can be widely used in integrated circuits, MEMS, biochips and other fields.

 

The working principle of the Ultraviolet lithography machine is to use an optical system to project ultraviolet light onto the photosensitive surface through the pattern in the mask, and finally form the required microstructure through the development, etching and other processes of the photoresist. Its main components include light source system, optical projection system, alignment system, control system, etc. UV lithography machines can accurately process at the micron or even nanometer level, which can meet the current needs of high-tech industries for precision processing.

 

 

This machine is aimed at universities, colleges, enterprises and scientific research institutions. Developed for the use characteristics of photolithography machines

 

A high-precision photolithography machine with three layers of shock absorption, modular and easy to disassemble.

It is mainly used in small and medium-sized integrated circuits, semiconductor components, optoelectronic devices, and acoustic meters.

Development and production of surface wave devices, thin film circuits, and power electronic devices, suitable for silicon wafers and glass

Exposure of flakes, ceramic flakes, copper flakes, stainless steel flakes, gemstone flakes, and also suitable for easy fragments such as: arsenic

Exposure of potassium chloride, indium phosphide, and exposure of non-circular substrates and small substrates.

 

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